1 / 4 www.a sb.co.kr november 2008 p lerow tm aln1100t2 internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application ba nd in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient i mplementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 950 1250 gain db 24 25 gain flatness db ? 1.0 ? 1.2 noise figure db 0.85 0.90 output ip3 (1) dbm 17 18 s11 / s22 (2) db - 18 / - 10 output p1db dbm 11 1 2 switching time (3) ? sec - supply current ma 20 25 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 23 ~ 25 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured with two tones at an output power of - 15 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to v s . pin number function 2 rf in 4 +vcc 6 rf out other s ground ou t line drawing (unit: mm) feature s s 21 = 26 db @ 950 mhz = 24 db @ 1250 mhz nf of 0.85 db over frequency unconditionally stable single 5v supply high oip3 @ low current note: 1. the numb er and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at t he left side. description (recommended footprint) aln1100t2 asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) solder stencil area c o u pl er website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion c o u pl er c o u pl er c o u pl er c o u pl er 2 - stage single type specifications (in pr o duction) typ. @ t = 25 ? c, v s = 5 v, freq. =1100 mhz, z o.sys = 50 o hm
2 / 4 www.a sb.co.kr november 2008 p lerow tm aln1100t2 internally matched lna module s - param e ters noise figure oip3 p1db 950~125 0 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 4 www.a sb.co.kr november 2008 p lerow tm aln1100t2 internally matched lna module item vol t age s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) cur rent (ma) 4.5 - 17.21 - 11.12 22.79 1.97 0.926 12.66 13.58 13 4.6 - 17.80 - 11.46 23.50 1.98 0.914 12.65 14.73 14 4.7 - 18.44 - 11.48 24.12 1.99 0.896 12.63 16.04 15 4.8 - 19.08 - 11.29 24.65 2.01 0.879 12.42 16.97 17 4.9 - 19.75 - 10.98 25.12 2.03 0.855 12.32 18.55 19 5.0 - 20.49 - 10.59 25.52 2.05 0.839 12.15 19.61 20 5.1 - 21.27 - 10.22 25.88 2.07 0.831 12.15 20.72 22 5.2 - 21.94 - 9.86 26.18 2.09 0.817 12.67 21.81 24 5.3 - 21.97 - 9.53 26.45 2.11 0.814 13.12 22.75 27 5.4 - 22.11 - 9.23 26.69 2.13 0.794 13.62 23.6 3 29 5.5 - 22.12 - 9.68 26.90 2.12 0.785 14.27 24.72 32 item temp. s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) current (ma) - 40 ? c - 20.57 - 10.50 25.43 2.0 0.607 13.85 15.26 17 - 20 ? c - 22.55 - 10.47 25.42 2.1 0.664 13.52 26.23 1 8 0 ? c - 21.42 - 10.51 25.59 2.04 0.742 12.89 17.41 19 25 ? c - 20.58 - 10.44 25.70 2.04 0.845 12.13 18.88 21 40 ? c - 19.92 - 10.41 25.68 2.04 0.913 12.05 19.40 22 60 ? c - 19.36 - 10.44 25.61 2.04 0.956 11.95 20.37 24 80 ? c - 18.82 - 10.51 25.57 2.05 1.070 11.93 21.3 5 25 100 ? c - 18.38 - 10.55 25.52 2.05 1.175 11.98 22.02 27 rf performance with voltage change rf performance with operating temperature
4 / 4 www.a sb.co.kr november 2008 p lerow tm aln1100t2 internally matched lna module 1) the tantal capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be dete r mined by customer s dc supply status. 2) so - called dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are included inside the lna module. therefo re, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e quency. application circuit recomme nded soldering reflow process evaluation board layout + - aln out in c1 c2 tantal c a pacitor v dc 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) size 25 x 25mm in out +vcc (for aln - at, bt, t series C 10x10mm)
|
